Confirmation of chiplet package structure by mechanical polishing.
Cross-sectional samples were created using X-ray CT observation and mechanical polishing, and structural confirmation was conducted!
Regarding the chip mounted on the main circuit board of the VR goggles manufactured by Company A, upon visual observation, it was inferred that it has a chiplet structure with multiple chips integrated. To examine the structure in more detail, we created a cross-section using X-ray CT observation and mechanical polishing, and we will introduce the structural confirmation. *For detailed information, please refer to the attached PDF document. For more details, feel free to download the PDF or contact us.
- Company：アイテス
- Price：Other
